Engineer for Assembly & Packaging MEMS-Sensors
Bosch
Reutlingen, BW, de
vor 1 Tg.

Job Description

  • Create something new : You industrialize new sensor products and manufacturing processes in the area of consumer electronics and transfer them from development to high-volume manufacturing
  • Shape the future : You lead projects to optimize complex manufacturing processes in assembly and interconnection technology
  • Take responsibility : You are responsible for definition and tracking of quality, costs and delivery targets of our suppliers
  • Integrated approach : Together with our suppliers in Asia and the internal support functions, you ensure the technical requirements of the sensors in high-volume production
  • Be connected : You coordinate cross-functional international teams and act as interface between our suppliers and internal functions
  • Live internationally : You are responsible for the selection and support of assembly lines at our external suppliers in Asia
  • Qualifications

  • Personality : Communicative, assertive, creative, enthusiasm for new topics, willingness to travel
  • Working Practice : Structured and analytical way of working, high sense of responsibility, enjoyment of intercultural project work
  • Experience and Knowledge : 3-5 years of professional experience in semiconductor / sensors packaging (development or manufacturing)
  • Qualifications : Experience in the field of semiconductors, MEMS and / or assembly technology is desirable
  • Languages : Excellent written and spoken English
  • Education : Diploma or master’s degree in engineering, e.g. materials science, electrical engineering, mechanical engineering, physics, manufacturing technology or a comparable field of study
  • Additional Information

    Need support during your application?

    Jasmin Merz (Human Resources)

  • 49 7121 35-33753
  • Need further information about the job?

    Bernt Schellin (Functional Department)

  • 49 7121 35-6117
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