Projektleiter Wafer Level Packaging Senior/Staff Engineer (f/m/d)- RF360 Munich, Germany
Qualcomm
Munich
vor 2 Tg.

Company : RF360 Europe GmbH

Job Area :

Engineering Group, Engineering Group >

Tasks :

Management of demanding and cross-location technology projects in the area of wafer level packaging

Development, definition and qualification of complex process sequences, also in cooperation with foreign locations

Planning, coordinating and tracking the activities of project members

Communication with the involved locations

  • Presentation of the results in management meetings; Creation of project documentation;
  • Required education :

    Successfully completed studies in the field of physics / microsystems technology / process engineering / chemistry

    Required knowledge :

    In-depth knowledge of the processes and processing of wafer level packages

    Several years of professional experience in manufacturing and / or in process / technology development

    Purposeful, careful and organized way of working

    Experience in developing processes or process sequences

    Very good communication skills

    Ability to work in a team

    Very good written and spoken English

    What's an Offer / Benefits :

    Apart from working in an open, relaxed and collaborative space, you will enjoy :

    Employer-financed pension schemes

    Employee Stock Purchase Plan (ESPP)

    Intensive onboarding training

    Staff canteen

    Company Medical Officer on site

    Further training opportunities

    Excellent central location in Munich, in walking distance to Ostbahnhof / Werksviertel

    You will become part of a highly motivated and experienced team that works together from several locations around the world.

    We are looking forward to your complete and compelling application!

    Minimum Qualifications

    Education :

    Bachelors - Computer Science, Bachelors - Engineering, Bachelors - Information Systems

    Work Experiences :

    5+ years Hardware Engineering experience or related work experience.

    Certifications : Skills :

    Skills :

    Preferred Qualifications

    Education :

    Masters - Computer Science, Masters - Engineering, Masters - Information Systems

    Work Experiences :

    1+ years in a technical leadership role with or without direct reports. ,2+ years experience with hardware design and measurement instruments such as oscilloscopes, spectrum analyzers, RF tools, etc.

    2+ years experience utilizing schematic capture and circuit simulation software. ,2+ years experience with circuit design (e.

    g., digital, analog, RF). ,8+ years Hardware Engineering experience or related work experience.

    Certifications : Skills :

    Skills :

    Computer Science, DSP Architectures, Electrical Engineering, Optical Systems, Packaging Systems

  • References to a particular number of years experience are for indicative purposes only. Applications from candidates with equivalent experience will be considered, provided that the candidate can demonstrate an ability to fulfill the principal duties of the role and possesses the required competencies.
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